Abstract: Progress in Compound Semiconductors is hindered by the high level of defectivity of the initial material. Here we take Silicon Carbide manufacturing technology as an example and provide an overview of manufacturing analytics tools and methodologies used to drive yield ramp and capacity expansion. We focus on 2 examples of site-to-site handoff: substrates handoff to IC front-end fab or foundry and wafer hand-off to the assembly and test site. Holistic end-to-end yield management is enabled by deploying Big Data platform at the enterprise level. This framework applies to both fabless companies and IDM’s. It also extends to a fully outsourced, fully vertically integrated IDM and anything in between.
Keywords: Compound Semiconductors, Silicon Carbide, Manufacturing Analytics, Process Control, Yield Management